SuperServer 6029TP-HC0R
Key Applications / Features – Compute Intensive Application |
– HPC, Data Center |
– Enterprise Server |
– Financial Analysis |
– Mission-critical applications |
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: |
1. Dual Socket P (LGA 3647) support |
2nd Gen Intel® Xeon® Scalable |
processors (Cascade Lake/Skylake)‡ |
2. 16 DIMMs; up to 4TB 3DS ECC |
DDR4-2933MHz† RDIMM/LRDIMM, |
Supports Intel® Optane™ DCPMM†† |
3. 2 PCI-E 3.0 x16 (LP) slots |
4. Flexible Networking support via SIOM; |
Dedicated IPMI 2.0 LAN |
5. 3 Hot-swap 3.5″ SAS/SATA drive bays |
6. Broadcom 3008 SAS3 controller; |
RAID 0, 1, 1E |
7. Mini-mSATA (half size) support |
8. Up to 2200W Redundant Power Supplies |
Titanium Level (96%) |
Product SKUs | |
SYS-6029TP-HC0R | SuperServer 6029TP-HC0R (Black) |
Motherboard (Four per System) | |
Super X11DPT-PS | |
Processor (per Node) | |
CPU | Dual Socket P (LGA 3647) |
2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡, | |
Dual UPI up to 10.4GT/s | |
Support CPU TDP 70-165W* | |
Cores | Up to 28 Cores |
Note | * Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) processors. |
Note | *Processors ending N or S are optimized for networking and storage applications. Customer need POC their application and observe any thermal throttling before large deployment. |
Note | ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R) |
System Memory (per Node) | |
Memory Capacity | 16 DIMM slots |
Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM | |
Supports Intel® Optane™ DCPMM†† | |
Memory Type | 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM |
Note | † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro |
†† Cascade Lake only. Contact your Supermicro sales rep for more info. | |
On-Board Devices (per Node) | |
Chipset | Intel® C621 chipset |
SAS | Broadcom 3008 SAS3 (12Gbps) controller; |
RAID 0, 1, 1E support | |
Network Controllers | Barebones and Complete System must have at least one SIOM or network card installed per node |
IPMI | Support for Intelligent Platform Management Interface v.2.0 |
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support | |
Graphics | ASPEED AST2500 BMC |
Input / Output (per Node) | |
SAS | 3 SAS3 (12Gbps) ports |
LAN | 1 RJ45 Dedicated IPMI LAN port |
USB | 2 USB 3.0 ports total (rear) |
VGA | 1 VGA port |
Serial Port / Header | 1 Fast UART 16550 port / 1 Header (internal) |
Others | 2 SuperDOM support on the motherboard |
1 NVMe or 2 SATA M.2 (22×80/60/42 mm) support with option part: AOC-SMG3-2H8M2 | |
M.2 and SuperDOM are for OS boot and they cannot coexist | |
System BIOS | |
BIOS Type | AMI 32MB SPI Flash ROM |
Management | |
Software | Intel® Node Manager |
IPMI 2.0 | |
KVM with dedicated LAN | |
NMI | |
SSM, SPM, SUM | |
SuperDoctor® 5 | |
Watchdog | |
Power Configurations | ACPI Power Management |
PC Health Monitoring | |
CPU | Monitors for CPU Cores, Chipset Voltages, Memory. |
5+1 Phase-switching voltage regulator | |
FAN | Fans with tachometer monitoring |
Status monitor for speed control | |
Pulse Width Modulated (PWM) fan connectors | |
Temperature | Monitoring for CPU and chassis environment |
Thermal Control for fan connectors | |
Omni-Path Fabric CPUs | Do not support |
Chassis | |
Form Factor | 2U Rackmount |
Model | CSE-827HQ+-R2K20BP2 |
Dimensions and Weight | |
Width | 17.25″ (438mm) |
Height | 3.47″ (88mm) |
Depth | 30.5″ (774mm) |
Weight | Gross Weight: 90 lbs (40.9kg) |
Net Weight: 72 lbs (32.7 kg) | |
Available Colors | Black |
Front Panel | |
Buttons | Power On/Off button |
UID button | |
LEDs | Power status LED |
HDD activity LED | |
Network activity LEDs | |
Universal Information (UID) LED | |
Expansion Slots (per Node) | |
PCI-Express | 2 PCI-E 3.0 x16 Low-profile slots |
1 SIOM card support | |
Note: Barebones and Complete System must bundle with Network Card | |
(With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function) | |
Drive Bays (per Node) | |
Hot-swap | 3 Hot-swap 3.5″ SAS/SATA HDD trays |
System Cooling | |
Fans | 4 Heavy duty 8cm PWM fans with optimal fan speed control |
Power Supply | |
2200W Redundant Power Supplies with PMBus | |
Total Output Power and Input | 1200W with Input 100-127Vac |
1800W with Input 200-220Vac | |
1980W with Input 220-230Vac | |
2090W with Input 230-240Vac | |
2200W with Input 220-240Vac (for UL/cUL use only) | |
2090W with Input 230-240Vdc (for CCC only) | |
AC Input Frequency | 50-60Hz |
Dimension | 76 x 40 x 336 mm |
(W x H x L) | |
+12V | Max: 100A / Min: 0A (100-127Vac) |
Max: 150A / Min: 0A (200-220Vac) | |
Max: 165A / Min: 0A (220-230Vac) | |
Max: 174.17A / Min: 0A (230-240Vac) | |
Max: 183.3A / Min: 0A (220-240Vac) | |
5VSB | Max: 1A / Min: 0A |
Output Type | Backplanes (gold finger) |
Certification | Titanium Level |
[ Test Report ] | |
Operating Environment | |
RoHS | RoHS Compliant |
Environmental Spec. | Operating Temperature: |
10°C ~ 35°C (50°F ~ 95°F) | |
Non-operating Temperature: | |
-40°C to 60°C (-40°F to 140°F) | |
Operating Relative Humidity: | |
8% to 90% (non-condensing) | |
Non-operating Relative Humidity: | |
5% to 95% (non-condensing) |
Specification
Parts List – (Items Included) | |||
Part Number | Qty | Description | |
Motherboard / Chassis | MBD-X11DPT-PS | 4 | Super X11DPT-PS Motherboard |
CSE-827HQ+-R2K20BP2 | 1 | 2U Chassis | |
Backplane | BPN-ADP-S3008L-L6IP | 4 | LSI 3008, SAS 12Gbs (X6 port inside) |
Backplane | BPN-SAS3-827HQ2 | 1 | 2U 12-Port 4-Node Backplane Supports 3×3.5 |
Cable 1 | CBL-PWCD-0578 | 2 | PWCD,US,IEC60320 C14 TO C13,3FT,14AWG |
Parts | MCP-240-82715-0N | 1 | TwinPro SC827HQ+ BPN retention bracket assembly |
Air Shroud | MCP-310-21716-0B | 4 | Twinpro X11 air shroud |
Riser Card | RSC-P-6 | 4 | RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
Riser Card | RSC-R1UTP-E16R | 4 | 1U RHS TwinPro Riser card with one PCI-E x16 slot |
Heatsink / Retention | SNK-P0067PS | 4 | 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
Heatsink / Retention | SNK-P0067PSM | 4 | 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
Power Supply | PWS-2K20A-1R | 2 | 1U 2200W Redundant, Titanium, 76(W) X 40(H) X 336(L) mm |
FAN 1 | FAN-0162L4 | 4 | 80x80x38 mm, 13.5K RPM, HCP, LMV, and LPC Cooling Fan,RoHS/REACH |
Optional Parts List | |||
Part Number | Qty | Description | |
TPM security module (optional, not included) | AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
TPM security module (optional, not included) | AOM-TPM-9671V | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |
Add-on-Card | AOC-SMG3-2H8M2 | – | AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA), |
FST-SCRW-0121L is included in AOC-SMG3-2H8M2 | |||
Hot-swap 3.5″ to 2.5″ Hard Disk Drive Tray | MCP-220-00043-0N | – | Black Hot-swap gen 4 3.5″ to 2.5″ HDD tray |
Global Services & Support | OS4HR3/2/1 | – | 3/2/1-year onsite 24x7x4 service |
OSNBD3/2/1 | – | 3/2/1-year onsite NBD service | |
Software | SFT-OOB-LIC • | 1 | OOB Management Package (per node license) |
Software | SFT-DCMS-Single | 1 | DataCenter Management Package (per node license) |
Packing Information
SuperServer 6029TP-HC0R is sealed in Brocade original box. We will also pack SuperChassis 6029TP-HC0R the second box before shipping.
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Shipment
Our products will be sent via FedEx,DHL,TNT,UPS,EMS,and so on.but the buyer is responsible for
customs clearance and pay tariff when the product arrived destination country.
Shipping Methods
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2-4 business days
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2-4 business days
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2-4 business days
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