SuperServer 6029TP-HC0R
| Schlüsselanwendungen / Merkmale – Compute Intensive Application |
| – HPC, Rechenzentrum |
| – Unternehmensserver |
| – Financial Analysis |
| – Mission-critical applications |
| Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: |
| 1. Doppelsteckdose P (LGA 3647) Unterstützung |
| 2Skalierbarer Intel® Xeon® der 2. Generation |
| Prozessoren (Cascade Lake/Skylake)‡ |
| 2. 16 DIMMs; bis zu 4 TB 3DS ECC |
| DDR4-2933MHz† RDIMM/LRDIMM, |
| Supports Intel® Optane™ DCPMM†† |
| 3. 2 PCI-E 3.0 x16 (LP) Schlüssel |
| 4. Flexible Networking support via SIOM; |
| Dedicated IPMI 2.0 LAN |
| 5. 3 Hot-Swap 3.5″ SAS/SATA drive bays |
| 6. Broadcom 3008 SAS3 controller; |
| ÜBERFALL 0, 1, 1E |
| 7. Mini-mSATA (half size) Unterstützung |
| 8. Up to 2200W Redundant Power Supplies |
| Titanniveau (96%) |
| Product SKUs | |
| SYS-6029TP-HC0R | SuperServer 6029TP-HC0R (Schwarz) |
| Hauptplatine (Four per System) | |
| Super X11DPT-PS | |
| Prozessor (per Node) | |
| CPU | Doppelsteckdose P (LGA 3647) |
| 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡, | |
| Dual UPI up to 10.4GT/s | |
| Support CPU TDP 70-165W* | |
| Kerne | Bis zu 28 Kerne |
| Notiz | * Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) Prozessoren. |
| Notiz | *Processors ending N or S are optimized for networking and storage applications. Customer need POC their application and observe any thermal throttling before large deployment. |
| Notiz | ‡ BIOS version 3.2 oder höher ist erforderlich, um skalierbare Intel® Xeon® Prozessoren der 2. Generation zu unterstützen (Codename Cascade Lake-R) |
| Systemspeicher (per Node) | |
| Speicherkapazität | 16 DIMM-Steckplätze |
| Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM | |
| Supports Intel® Optane™ DCPMM†† | |
| Speichertyp | 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM |
| Notiz | † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro |
| †† Cascade Lake only. Weitere Informationen erhalten Sie von Ihrem Supermicro-Vertriebsmitarbeiter. | |
| On-Board Devices (per Node) | |
| Chipset | Intel® C621 chipset |
| SAS | Broadcom 3008 SAS3 (12Gbit/s) controller; |
| ÜBERFALL 0, 1, 1E support | |
| Network Controllers | Barebones and Complete System must have at least one SIOM or network card installed per node |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 |
| IPMI 2.0 with virtual media over LAN and KVM-over-LAN support | |
| Grafik | ASPEED AST2500 BMC |
| Eingang / Output (per Node) | |
| SAS | 3 SAS3 (12Gbit/s) Häfen |
| LAN | 1 RJ45 Dedicated IPMI LAN port |
| USB | 2 USB 3.0 ports total (hinteren) |
| VGA | 1 VGA port |
| Serielle Schnittstelle / Header | 1 Fast UART 16550 Hafen / 1 Header (intern) |
| Others | 2 SuperDOM support on the motherboard |
| 1 NVMe or 2 SATA M.2 (22×80/60/42 mm) support with option part: AOC-SMG3-2H8M2 | |
| M.2 and SuperDOM are for OS boot and they cannot coexist | |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash ROM |
| Management | |
| Software | Intel® Node Manager |
| IPMI 2.0 | |
| KVM with dedicated LAN | |
| NMI | |
| SSM, SPM, SUM | |
| SuperDoctor® 5 | |
| Watchdog | |
| Power Configurations | ACPI Power Management |
| PC Health Monitoring | |
| CPU | Monitors for CPU Cores, Chipset Voltages, Erinnerung. |
| 5+1 Phase-switching voltage regulator | |
| LÜFTER | Fans with tachometer monitoring |
| Status monitor for speed control | |
| Pulse Width Modulated (PWM) fan connectors | |
| Temperatur | Monitoring for CPU and chassis environment |
| Thermal Control for fan connectors | |
| Omni-Path Fabric CPUs | Do not support |
| Chassis | |
| Formfaktor | 2U-Rackmount |
| Modell | CSE-827HQ+-R2K20BP2 |
| Dimensions and Weight | |
| Breite | 17.25″ (438mm) |
| Höhe | 3.47″ (88mm) |
| Tiefe | 30.5″ (774mm) |
| Gewicht | Bruttogewicht: 90 Pfund (40.9kg) |
| Nettogewicht: 72 Pfund (32.7 kg) | |
| Verfügbare Farben | Schwarz |
| Front Panel | |
| Tasten | Power On/Off button |
| UID button | |
| LEDs | Power status LED |
| HDD activity LED | |
| Network activity LEDs | |
| Universal Information (UID) LED | |
| Erweiterungssteckplätze (per Node) | |
| PCI-Express | 2 PCI-E 3.0 x16 Low-profile slots |
| 1 SIOM card support | |
| Notiz: Barebones and Complete System must bundle with Network Card | |
| (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function) | |
| Drive Bays (per Node) | |
| Hot-swap | 3 Hot-Swap 3.5″ SAS/SATA HDD trays |
| System Cooling | |
| Fans | 4 Heavy duty 8cm PWM fans with optimal fan speed control |
| Stromversorgung | |
| 2200W Redundant Power Supplies with PMBus | |
| Total Output Power and Input | 1200W with Input 100-127Vac |
| 1800W with Input 200-220Vac | |
| 1980W with Input 220-230Vac | |
| 2090W with Input 230-240Vac | |
| 2200W with Input 220-240Vac (for UL/cUL use only) | |
| 2090W with Input 230-240Vdc (for CCC only) | |
| AC-Eingangsfrequenz | 50-60Hz |
| Abmessungen | 76 X 40 X 336 mm |
| (W x H x L) | |
| +12V | Max: 100A / Mindest: 0A (100-127Vac) |
| Max: 150A / Mindest: 0A (200-220Vac) | |
| Max: 165A / Mindest: 0A (220-230Vac) | |
| Max: 174.17A / Mindest: 0A (230-240Vac) | |
| Max: 183.3A / Mindest: 0A (220-240Vac) | |
| 5VSB | Max: 1A / Mindest: 0A |
| Output Type | Backplanes (gold finger) |
| Zertifizierung | Titanniveau |
| [ Test Report ] | |
| Operating Environment | |
| RoHS | RoHS-konform |
| Environmental Spec. | Betriebstemperatur: |
| 10°C ~ 35°C (50°F ~ 95°F) | |
| Non-operating Temperature: | |
| -40°C to 60°C (-40°F to 140°F) | |
| Operating Relative Humidity: | |
| 8% Zu 90% (nicht kondensierend) | |
| Non-operating Relative Humidity: | |
| 5% Zu 95% (nicht kondensierend) | |
Spezifikation
| Liste der Einzelteile – (Enthaltene Artikel) | |||
| Artikelnummer | Menge | Beschreibung | |
| Hauptplatine / Chassis | MBD-X11DPT-PS | 4 | Super X11DPT-PS Motherboard |
| CSE-827HQ+-R2K20BP2 | 1 | 2U-Chassis | |
| Rückwandplatine | BPN-ADP-S3008L-L6IP | 4 | LSI 3008, SAS 12Gbs (X6 port inside) |
| Rückwandplatine | BPN-SAS3-827HQ2 | 1 | 2U 12-Port 4-Node Backplane Supports 3×3.5 |
| Kabel 1 | CBL-PWCD-0578 | 2 | PWCD,US,IEC60320 C14 TO C13,3FT,14AWG |
| Teile | MCP-240-82715-0N | 1 | TwinPro SC827HQ+ BPN retention bracket assembly |
| Air Shroud | MCP-310-21716-0B | 4 | Twinpro X11 air shroud |
| Riser Card | RSC-P-6 | 4 | RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS |
| Riser Card | RSC-R1UTP-E16R | 4 | 1U RHS TwinPro Riser card with one PCI-E x16 slot |
| Kühlkörper / Zurückbehaltung | SNK-P0067PS | 4 | 1Passiver U-CPU-Kühlkörper für die X11-Purley-Plattform, ausgestattet mit einem schmalen Haltemechanismus |
| Kühlkörper / Zurückbehaltung | SNK-P0067PSM | 4 | 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
| Stromversorgung | PWS-2K20A-1R | 2 | 1U 2200W Redundant, Titan, 76(W) X 40(H) X 336(L) mm |
| LÜFTER 1 | LÜFTER-0162L4 | 4 | 80x80x38 mm, 13.5K U/min, HCP, LMV, and LPC Cooling Fan,RoHS/REACH |
| Optionale Teileliste | |||
| Artikelnummer | Menge | Beschreibung | |
| TPM security module (Optional, not included) | AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
| TPM security module (Optional, not included) | AOM-TPM-9671V | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |
| Add-on-Card | AOC-SMG3-2H8M2 | – | AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA), |
| FST-SCRW-0121L is included in AOC-SMG3-2H8M2 | |||
| Hot-Swap 3.5″ bis 2,5″ Hard Disk Drive Tray | MCP-220-00043-0N | – | Black Hot-swap gen 4 3.5″ bis 2,5″ Festplattenfach |
| Globale Dienste & Unterstützung | OS4HR3/2/1 | – | 3/2/1-Jahr Vor-Ort-Service rund um die Uhr |
| OSNBD3/2/1 | – | 3/2/1-Jahr Vor-Ort-NBD-Service | |
| Software | SFT-OOB-LIC • | 1 | OOB-Verwaltungspaket (pro Knotenlizenz) |
| Software | SFT-DCMS-Single | 1 | DataCenter-Verwaltungspaket (pro Knotenlizenz) |
Verpackungsinformationen
SuperServer 6029TP-HC0R is sealed in Brocade original box. We will also pack SuperChassis 6029TP-HC0R the second box before shipping.
Sendung
Unsere Produkte werden per FedEx versendet,DHL,TNT,UPS,EMS,und so weiter. aber der käufer ist verantwortlich für
Zollabfertigung und Zahlung des Tarifs, wenn das Produkt im Zielland ankommt.
Versandarten
2-4 Arbeitstage
2-4 Arbeitstage
2-4 Arbeitstage
5-7 Arbeitstage
Bezahlverfahren
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