الخادم الخارق 6029TP-HC0R
| Key Applications / سمات – Compute Intensive Application |
| – HPC, Data Center |
| – Enterprise Server |
| – Financial Analysis |
| – Mission-critical applications |
| Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: |
| 1. Dual Socket P (LGA 3647) يدعم |
| 2nd Gen Intel® Xeon® Scalable |
| processors (Cascade Lake/Skylake)‡ |
| 2. 16 DIMMs; up to 4TB 3DS ECC |
| DDR4-2933MHz† RDIMM/LRDIMM, |
| Supports Intel® Optane™ DCPMM†† |
| 3. 2 PCI-E 3.0 x16 (LP) فتحات |
| 4. Flexible Networking support via SIOM; |
| Dedicated IPMI 2.0 لان |
| 5. 3 Hot-swap 3.5″ SAS/SATA drive bays |
| 6. Broadcom 3008 SAS3 controller; |
| RAID 0, 1, 1ه |
| 7. Mini-mSATA (half size) يدعم |
| 8. Up to 2200W Redundant Power Supplies |
| Titanium Level (96%) |
| وحدات SKU للمنتج | |
| SYS-6029TP-HC0R | الخادم الخارق 6029TP-HC0R (أسود) |
| اللوحة الأم (Four per System) | |
| Super X11DPT-PS | |
| المعالج (per Node) | |
| وحدة المعالجة المركزية | Dual Socket P (LGA 3647) |
| 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡, | |
| Dual UPI up to 10.4GT/s | |
| Support CPU TDP 70-165W* | |
| Cores | يصل إلى 28 Cores |
| ملحوظة | * Please contact Supermicro Technical Support for supporting conditions of high power (TDP 150W and above) or high base frequency (3.0 GHz and above) processors. |
| ملحوظة | *Processors ending N or S are optimized for networking and storage applications. Customer need POC their application and observe any thermal throttling before large deployment. |
| ملحوظة | ‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R) |
| ذاكرة النظام (per Node) | |
| Memory Capacity | 16 DIMM slots |
| Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM | |
| Supports Intel® Optane™ DCPMM†† | |
| Memory Type | 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM |
| ملحوظة | † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro |
| †† Cascade Lake only. Contact your Supermicro sales rep for more info. | |
| On-Board Devices (per Node) | |
| Chipset | Intel® C621 chipset |
| SAS | Broadcom 3008 SAS3 (12جيجابت في الثانية) controller; |
| RAID 0, 1, 1E support | |
| Network Controllers | Barebones and Complete System must have at least one SIOM or network card installed per node |
| IPMI | Support for Intelligent Platform Management Interface v.2.0 |
| IPMI 2.0 with virtual media over LAN and KVM-over-LAN support | |
| Graphics | ASPEED AST2500 BMC |
| Input / Output (per Node) | |
| SAS | 3 SAS3 (12جيجابت في الثانية) الموانئ |
| لان | 1 RJ45 Dedicated IPMI LAN port |
| USB | 2 USB 3.0 ports total (rear) |
| VGA | 1 VGA port |
| منفذ تسلسلي / رأس | 1 Fast UART 16550 ميناء / 1 رأس (داخلي) |
| Others | 2 SuperDOM support on the motherboard |
| 1 NVMe or 2 SATA M.2 (22×80/60/42 مم) support with option part: AOC-SMG3-2H8M2 | |
| M.2 and SuperDOM are for OS boot and they cannot coexist | |
| System BIOS | |
| BIOS Type | AMI 32MB SPI Flash ROM |
| إدارة | |
| برمجة | Intel® Node Manager |
| IPMI 2.0 | |
| KVM with dedicated LAN | |
| NMI | |
| SSM, SPM, SUM | |
| SuperDoctor® 5 | |
| Watchdog | |
| Power Configurations | ACPI Power Management |
| PC Health Monitoring | |
| وحدة المعالجة المركزية | Monitors for CPU Cores, Chipset Voltages, ذاكرة. |
| 5+1 Phase-switching voltage regulator | |
| معجب | Fans with tachometer monitoring |
| Status monitor for speed control | |
| Pulse Width Modulated (PWM) fan connectors | |
| درجة حرارة | Monitoring for CPU and chassis environment |
| Thermal Control for fan connectors | |
| Omni-Path Fabric CPUs | Do not support |
| الهيكل | |
| شكل عامل | 2U Rackmount |
| نموذج | CSE-827HQ+-R2K20BP2 |
| Dimensions and Weight | |
| عرض | 17.25″ (438مم) |
| ارتفاع | 3.47″ (88مم) |
| عمق | 30.5″ (774مم) |
| وزن | الوزن الإجمالي: 90 رطل (40.9كلغ) |
| الوزن الصافي: 72 رطل (32.7 كلغ) | |
| Available Colors | أسود |
| اللوحة الامامية | |
| Buttons | زر تشغيل/إيقاف التشغيل |
| UID button | |
| LEDs | مؤشر LED لحالة الطاقة |
| مؤشر LED لنشاط القرص الصلب | |
| Network activity LEDs | |
| Universal Information (معرف فريد) قاد | |
| فتحات التوسعة (per Node) | |
| PCI-Express | 2 PCI-E 3.0 x16 Low-profile slots |
| 1 SIOM card support | |
| ملحوظة: Barebones and Complete System must bundle with Network Card | |
| (With only one CPU installed, SXB2 M.2 and SXB4 riser card slots not function) | |
| حملة الخلجان (per Node) | |
| Hot-swap | 3 Hot-swap 3.5″ SAS/SATA HDD trays |
| System Cooling | |
| المشجعين | 4 Heavy duty 8cm PWM fans with optimal fan speed control |
| مزود الطاقة | |
| 2200W Redundant Power Supplies with PMBus | |
| إجمالي طاقة الإخراج والمدخلات | 1200W with Input 100-127Vac |
| 1800W with Input 200-220Vac | |
| 1980W with Input 220-230Vac | |
| 2090W with Input 230-240Vac | |
| 2200W with Input 220-240Vac (for UL/cUL use only) | |
| 2090W with Input 230-240Vdc (for CCC only) | |
| تردد إدخال التيار المتردد | 50-60هرتز |
| Dimension | 76 x 40 x 336 مم |
| (العرض × الارتفاع × الطول) | |
| +12الخامس | الأعلى: 100أ / دقيقة: 0أ (100-127بطالة) |
| الأعلى: 150أ / دقيقة: 0أ (200-220بطالة) | |
| الأعلى: 165أ / دقيقة: 0أ (220-230بطالة) | |
| الأعلى: 174.17أ / دقيقة: 0أ (230-240بطالة) | |
| الأعلى: 183.3أ / دقيقة: 0أ (220-240بطالة) | |
| 5VSB | الأعلى: 1أ / دقيقة: 0أ |
| نوع الإخراج | Backplanes (gold finger) |
| شهادة | Titanium Level |
| [ Test Report ] | |
| بيئة التشغيل | |
| بنفايات | RoHS Compliant |
| Environmental Spec. | درجة حرارة التشغيل: |
| 10°C ~ 35°C (50°F ~ 95°F) | |
| Non-operating Temperature: | |
| -40°C to 60°C (-40°F to 140°F) | |
| Operating Relative Humidity: | |
| 8% ل 90% (غير التكثيف) | |
| Non-operating Relative Humidity: | |
| 5% ل 95% (غير التكثيف) | |
تخصيص
| Parts List – (Items Included) | |||
| رقم القطعة | الكمية | وصف | |
| اللوحة الأم / الهيكل | MBD-X11DPT-PS | 4 | Super X11DPT-PS Motherboard |
| CSE-827HQ+-R2K20BP2 | 1 | 2U Chassis | |
| لوحة الكترونية معززة | BPN-ADP-S3008L-L6IP | 4 | LSI 3008, SAS 12Gbs (X6 port inside) |
| لوحة الكترونية معززة | BPN-SAS3-827HQ2 | 1 | 2U 12-Port 4-Node Backplane Supports 3×3.5 |
| كابل 1 | CBL-PWCD-0578 | 2 | PWCD,US,IEC60320 C14 TO C13,3FT,14الفريق العامل المخصص |
| Parts | MCP-240-82715-0N | 1 | TwinPro SC827HQ+ BPN retention bracket assembly |
| كفن الهواء | MCP-310-21716-0B | 4 | Twinpro X11 air shroud |
| Riser Card | RSC-P-6 | 4 | RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),بنفايات |
| Riser Card | RSC-R1UTP-E16R | 4 | 1U RHS TwinPro Riser card with one PCI-E x16 slot |
| Heatsink / Retention | SNK-P0067PS | 4 | 1U Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
| Heatsink / Retention | SNK-P0067PSM | 4 | 1U Passive CPU Heat Sink with a 26-mm Wide Middle Air Channel for X11 Purley Platform Equipped with a Narrow Retention Mechanism |
| مزود الطاقة | PWS-2K20A-1R | 2 | 1U 2200W Redundant, Titanium, 76(دبليو) X 40(ح) X 336(ل) مم |
| معجب 1 | معجب-0162L4 | 4 | 80x80x38 mm, 13.5K RPM, HCP, LMV, and LPC Cooling Fan,RoHS/REACH |
| Optional Parts List | |||
| رقم القطعة | الكمية | وصف | |
| TPM security module (خياري, not included) | AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
| TPM security module (خياري, not included) | AOM-TPM-9671V | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |
| Add-on-Card | AOC-SMG3-2H8M2 | – | AOC supports 2280 M.2 form factor SSD (1 NVMe or 2 SATA), |
| FST-SCRW-0121L is included in AOC-SMG3-2H8M2 | |||
| Hot-swap 3.5″ to 2.5″ Hard Disk Drive Tray | MCP-220-00043-0N | – | Black Hot-swap gen 4 3.5″ to 2.5″ HDD tray |
| Global Services & يدعم | OS4HR3/2/1 | – | 3/2/1-year onsite 24x7x4 service |
| OSNBD3/2/1 | – | 3/2/1-year onsite NBD service | |
| برمجة | SFT-OOB-LIC • | 1 | OOB Management Package (per node license) |
| برمجة | SFT-DCMS-Single | 1 | DataCenter Management Package (per node license) |
جمع معلومات
SuperServer 6029TP-HC0R is sealed in Brocade original box. We will also pack SuperChassis 6029TP-HC0R the second box before shipping.
شحنة
سيتم إرسال منتجاتنا عبر FedEx,DHL,مادة تي إن تي,يو بي إس,EMS,وهلم جرا. ولكن المشتري هو المسؤول عن
التخليص الجمركي ودفع التعريفة الجمركية عند وصول المنتج إلى بلد المقصد.
طرق الشحن
2-4 أيام عمل
2-4 أيام عمل
2-4 أيام عمل
5-7 أيام عمل
طريقة الدفع او السداد
تي / ت,ويسترن يونيون, سيتم قبول HSBC و Money Gram. سيساعدك الدفع السريع في الحصول على العناصر في وقت مبكر.
المراجعات
لا توجد توصيات بعد.